DocumentCode

1718331

Title

A thermal aging study on both Au-Cu and Au-Al wire-bonded interfaces

Author

Lee, Chu-Chung ; Tran, Tu-Anh ; Yong, Lois ; Harun, Fuaida ; Yong, C.C.

Author_Institution

Motorola Inc.

fYear

2003

Firstpage

1761

Lastpage

1766

Keywords

Aging; Aluminum; Assembly; Ceramics; Copper; Oxidation; Testing; Vehicles; Wafer bonding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216540

Filename

1216540