DocumentCode :
1718670
Title :
Impact of ingressed moisture and high temperature warpage behavior on the robust assembly capability for large body PBGAs
Author :
Shook, R.L. ; Gilbert, J.J. ; Thomas, E. ; Vaccaro, B.T. ; Dairo, A. ; Horvath, C. ; Libricz, G.J. ; Crouthamel, D.L. ; Gerlach, D.L.
Author_Institution :
Agere Systems
fYear :
2003
Firstpage :
1823
Lastpage :
1828
Keywords :
Assembly; Delamination; Electronics packaging; Inspection; LAN interconnection; Lead; Moisture measurement; Plastic packaging; Robustness; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216551
Filename :
1216551
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1718670
