• DocumentCode
    171909
  • Title

    Modelling and analysis of different representations for high voltage tower structures

  • Author

    Plesch, J. ; Hoehn, T. ; Pack, S.

  • Author_Institution
    Inst. of High Voltage Eng. & Syst. Performance, Graz Univ. of Technol., Graz, Austria
  • fYear
    2014
  • fDate
    11-18 Oct. 2014
  • Firstpage
    446
  • Lastpage
    450
  • Abstract
    To evaluate the transient stress in the high voltage transmission system, numerical transient simulation programs are used. Transient stress is caused by lightning discharges, switching operations, faults etc. and may influence the operation of high voltage equipment. For the analysis and evaluation of flashovers, suitable numerical simulation models for high voltage tower structures are required. Also the modelling of arcing horns and the frequency dependent footing resistance are very important parts, which have to be considered. In case of lightning discharges to ground wire and the phase conductors, it is necessary to evaluate if a shielding failure can occur. To focus of this paper is to evaluate the probability of lightning strikes and the number of lightning strikes to overhead lines with the use of the electro-geometrical model.
  • Keywords
    earthing; failure analysis; flashover; high-voltage engineering; lightning; poles and towers; power overhead lines; power system transients; power transmission faults; probability; shielding; arcing horn; electrogeometrical model; flashover analysis; flashover evaluation; frequency dependent footing resistance; ground wire; high voltage equipment; high voltage tower structure; high voltage transmission system; lightning discharge; lightning strike probability; numerical simulation model; numerical transient simulation program; overhead line; phase conductor; shielding failure; switching operation; transient stress; transmission fault; Discharges (electric); Lightning; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lightning Protection (ICLP), 2014 International Conference o
  • Conference_Location
    Shanghai
  • Type

    conf

  • DOI
    10.1109/ICLP.2014.6973165
  • Filename
    6973165