DocumentCode :
1723305
Title :
Charging of dielectric barriers in rod-plane gaps
Author :
Mauseth, F. ; Nysveen, A. ; Ildstad, E.
Author_Institution :
Dept. of Electr. Power Eng., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
Volume :
1
fYear :
2004
Firstpage :
447
Abstract :
The electric properties of an air gap between a hemisphere-rod covered with 3 mm thick silicone rubber and plane metal electrode have been examined. Observation of discharge activity and measurement of the discharge current have been made under impulse voltage stress. When applying an impulse voltage close to the inception voltage, discharge activity is observed around the hemispheric tip of the rod. Observed light emission seems to be evenly distributed along the hemispheric tip comprising a number of independent discharges similar to discharges in a homogeneous electrode configuration. Applying a conductive layer at the rod tip reduces the discharge activity and measured discharge current considerably. The discharge activity was concentrated close to the tip end of the rod. Relaxation time constant for the deposited charge was measured to be about 4 h. By comparing conductivity of the insulation material, the dominating relaxation mechanism was found to be conduction through the solid insulation.
Keywords :
air gaps; dielectric materials; dielectric relaxation; discharges (electric); electrical conductivity; electrodes; insulating materials; silicone rubber; 3 mm; air gap; conductivity; dielectric barrier charging; discharge activity; discharge current; electric properties; hemisphere-rod; homogeneous electrode configuration; impulse voltage stress; inception voltage; insulation material; light emission; plane metal electrode; relaxation mechanism; relaxation time constant; rod-plane gaps; silicone rubber; Charge measurement; Conductivity measurement; Current measurement; Dielectric measurements; Electrodes; Insulation; Rubber; Stress measurement; Time measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid Dielectrics, 2004. ICSD 2004. Proceedings of the 2004 IEEE International Conference on
Print_ISBN :
0-7803-8348-6
Type :
conf
DOI :
10.1109/ICSD.2004.1350387
Filename :
1350387
Link To Document :
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