Title :
Capacity allocation in semiconductor fabrication
Author :
Feigin, Gerald E. ; Katircioglu, Kaan ; Yao, David D.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
6/21/1905 12:00:00 AM
Abstract :
One of the most serious challenges in the semiconductor memory business is the rapid price decline. We develop an allocation scheme that determines the die (chip) allocation among different memory products. The allocation takes into account available die capacity, customer service requirements, as well as price declines and demand distributions among different products
Keywords :
assembling; decision theory; optimisation; production control; resource allocation; wafer bonding; capacity allocation; chip allocation; customer service requirements; demand distributions; die allocation; die capacity; memory products; price decline; semiconductor fabrication; semiconductor memory; Assembly; Bonding; Consumer electronics; Costs; Customer service; Fabrication; Manufacturing; Semiconductor device manufacture; Semiconductor device packaging; Testing;
Conference_Titel :
Decision and Control, 1999. Proceedings of the 38th IEEE Conference on
Conference_Location :
Phoenix, AZ
Print_ISBN :
0-7803-5250-5
DOI :
10.1109/CDC.1999.830144
