• DocumentCode
    1728103
  • Title

    Study on mechanism and characteristics of dielectric breakdown in polyimide film

  • Author

    Shu, Wen ; Guo, Jun ; Zhan, Lei ; Zhang, Lily ; Wen, Fengxiang ; Wu, Guangning

  • Author_Institution
    Sch. of Electr. Eng., Southwest Jiaotong Univ., Chengdu, China
  • Volume
    2
  • fYear
    2004
  • Firstpage
    908
  • Abstract
    IGBT pulse width modulation (PWM) inverter driven induction motors for adjustable speed applications have been widely used since their introduction. However, the use of PWM variable frequency traction motor can lead to premature failure of the winding insulation, which most often occurs due to breakdown of the interturn insulation. In order to investigate the mechanism and characteristics of dielectric breakdown in a new kind of polyimide film, which is used as primary insulation in PWM inverter-fed traction motor, an experimental activity has been carried out on specimen according to applications in locomotives. The effect of different types of defects has been studied through several groups of breakdown test. Furthermore, fine texture of the breakdown part based on energy spectrum analysis and stereoscan photograph is analyzed; finally, the characterization and mechanism of the dielectric breakdown are presented.
  • Keywords
    dielectric thin films; electric breakdown; insulating thin films; noncrystalline defects; polymer films; texture; IGBT pulse width modulation; PWM inverter-fed traction motor; PWM variable frequency traction motor; breakdown test; defects; dielectric breakdown; energy spectrum analysis; interturn insulation; inverter driven induction motors; locomotives; polyimide film; stereoscan photograph; texture; winding insulation; Dielectric breakdown; Dielectrics and electrical insulation; Electric breakdown; Induction motors; Insulated gate bipolar transistors; Polyimides; Pulse inverters; Pulse width modulation; Pulse width modulation inverters; Traction motors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics, 2004. ICSD 2004. Proceedings of the 2004 IEEE International Conference on
  • Print_ISBN
    0-7803-8348-6
  • Type

    conf

  • DOI
    10.1109/ICSD.2004.1350579
  • Filename
    1350579