DocumentCode
1730293
Title
High temperature packaging for SAW transponder
Author
Fachberger, R. ; Bardong, J.
Author_Institution
Carinthian Tech Res. AG, CTR AG, Villach, Austria
fYear
2010
Firstpage
287
Lastpage
290
Abstract
A high temperature stable packaging for surface acoustic wave devices for application of radio frequency transponders in harsh environment was investigated. Several ceramic adhesives were tested and characterized for die bonding. The expected thermal stresses were calculated via finite elemente method. The adhesive forces were measured via shear tests after thermal aging of test samples up to temperatures of 850°C. The applicability of full functional Kovar based housings with ceramic to metal seals equipped with langasite devices was tested in-situ up to temperatures of 650°C.
Keywords
finite element analysis; packaging; surface acoustic waves; transponders; Kovar based housings; SAW transponder; adhesive forces; ceramic adhesives; ceramic seals; die bonding; finite elemente method; high temperature packaging; langasite devices; metal seals; radio frequency transponders; surface acoustic wave devices; temperature 650 degC; temperature 850 degC; thermal stresses; Adhesives; Aging; Crystals; Force; Metals; Surface acoustic waves; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium (FCS), 2010 IEEE International
Conference_Location
Newport Beach, CA
ISSN
1075-6787
Print_ISBN
978-1-4244-6399-2
Type
conf
DOI
10.1109/FREQ.2010.5556325
Filename
5556325
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