DocumentCode
1730486
Title
Reliability investigations of printed circuit boards
Author
Ehrler, Sylvia
Author_Institution
Hewlett-Packard GmbH, Boblingen, Germany
fYear
1998
Firstpage
236
Abstract
Summary form only given. Reliability is one of the key performance measures of current printed circuit boards. This paper deals with the reliability of various PCB base materials. The influence of plated Cu-thickness, surface finish metallization and aspect ratio and the possible difference between connections on the outer and inner layers of a board are considered
Keywords
circuit reliability; metallisation; printed circuit testing; printed circuits; surface treatment; Cu; PCB base materials; board inner layer connections; board outer layer connections; performance measures; plated Cu-thickness; printed circuit boards; reliability; surface finish aspect ratio; surface finish metallization; Assembly; Electric shock; Inorganic materials; Life testing; Materials reliability; Metallization; Printed circuits; Production; Temperature; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 2nd 1998
Conference_Location
Tokyo
Print_ISBN
0-7803-5090-1
Type
conf
DOI
10.1109/IEMTIM.1998.704628
Filename
704628
Link To Document