Elimination of CFC´s and the chemical waste with the use of no-clean solder in RF power module

The pursue of CFC use elimination in many industries has opened up an opportunity for the development of substitutes for CFCs. No clean solder is just one of the many examples developed in response this need. Besides the elimination of CFCs, this project was also set up to eliminate chemical waste disposal problems with such materials as Terpene, Ionox, flux residue etc. Through the ability of implementing the no clean solder, the authors have been able to eliminate these chemical wastes hence reducing the current existing problem. This report describes materials selection, method of paste application and the renew profile essential for achieving the no-clean process