DocumentCode :
1732588
Title :
Bumping and stacking processes for 3D IC using fluxfree polymer
Author :
Choi, Kwang-Seong ; Sung, Ki-Jun ; Bae, Hyun-Cheol ; Moon, Jong-Tae ; Eom, Yong-Sung
Author_Institution :
Convergence Components & Mater. Res. Lab., ETRI, Daejeon, South Korea
fYear :
2011
Firstpage :
1746
Lastpage :
1751
Abstract :
A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed to make solder bumps on TSVs. With the coining process, the standard deviation of bump heights became 1μm. Fluxing underfill which features an extremely low-weight loss with temperature, has been, also, developed to simplify the chip-to-chip and chip-to-wafer bonding processes and implement the mass reflow process for them. Therefore, these processes can be reduced to only three steps: dispensing fluxing underfill, pick and place of TSV chips, and reflow. With the fluxing underfill, a 4 × 4 array of 4 tier-stacked TSV chips on a Si wafer was, successfully, developed.
Keywords :
elemental semiconductors; resins; silicon; solders; three-dimensional integrated circuits; wafer bonding; 3D IC; Si; chip-to-chip bonding processes; chip-to-wafer bonding processes; fluxfree polymer; fluxing underfill; low-melting-point solder powder; low-volume bumping material; resin; size 1 mum; solder bump maker; stacking processes; tier-stacked TSV chips; Arrays; Bonding; Powders; Resins; Silicon; Substrates; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-61284-497-8
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2011.5898748
Filename :
5898748
Link To Document :
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