Title :
DCIM-accelerated SMFMA for capacitance extraction
Author :
Jiang, L.J. ; Chew, W.C. ; Pan, Y.C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
Recent advances in very large scale integration (VLSI) technology heighten the need for fast and accurate calculations of the capacitance and inductance matrices of complex 3D multiconductor structures in the presence of a layered dielectric medium. A stratified medium fast multipole algorithm (SMFMA) was developed to speedup capacitance extractions for the large-number-of-unknowns case with O(N) cost (Pan, Y.C., "Development of the fast multipole method for stratified medium", Ph.D thesis, Univ. of Illinois, 2002). But in the multilayer medium, the translators and near field interactions have no closed form. Therefore, the numerical integral computation for the translator preparations makes the SMFMA setup stage very time consuming. We derive a set of identities based on extended spherical harmonic functions in the complex plane. Combined with the discrete complex image method (DCIM), the multipole translators can be represented by simple closed-form expressions. The technique can make the SMFMA setup stage one to two-orders faster compared to the old method. It provides excellent accuracy with little computation costs.
Keywords :
VLSI; capacitance; electromagnetic field theory; inhomogeneous media; integral equations; matrix algebra; multilayers; 3D multiconductor structures; VLSI technology; capacitance extraction; capacitance matrices; closed-form expressions; discrete complex image method; extended spherical harmonic functions; inductance matrices; integral equation; layered dielectric medium; near field interactions; numerical integral computation; stratified medium fast multipole algorithm; translators; very large scale integration technology; Capacitance; Dielectrics; Inductance; Laboratories; Large-scale systems; Message-oriented middleware; Moment methods; Nonhomogeneous media; Reflection; Very large scale integration;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2003. IEEE
Conference_Location :
Columbus, OH, USA
Print_ISBN :
0-7803-7846-6
DOI :
10.1109/APS.2003.1217398