• DocumentCode
    1735264
  • Title

    A Field Analysis of System-level Effects of Soft Errors Occurring in Microprocessors used in Information Systems

  • Author

    Shazli, Syed Z. ; Abdul-Aziz, Mohammed ; Tahoori, Mehdi B. ; Kaeli, David R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Soft errors due to alpha and cosmic particles are a growing reliability threat to information systems. In this work, a methodology is developed to analyze the effects of single event upsets (SEU) and obtain FIT rates for commercial microprocessors in live information systems. Our methodology is based on data collected from error logs and error traces of the information systems present globally in the field. We also compare the system effects of errors that are suspected to be due to SEUs as compared with non-SEU errors. Soft errors are further localized within specific microprocessor resources with the assistance of the machine check architecture. The analyzed field data represents a world-wide population of microprocessors installed in the field. In total, several thousands systems and thirty-six months of field data were analyzed. The methodology used in carrying out this field analysis is discussed in detail and results are presented.
  • Keywords
    error correction; information systems; integrated circuit reliability; microprocessor chips; alpha particles; cosmic particles; error logs; error traces; information systems; machine check architecture; microprocessors; reliability; single event upsets; soft errors; system-level effects; Computer errors; Data analysis; Error analysis; Estimation error; Hardware; Information analysis; Information systems; Microprocessors; Power system reliability; Single event upset;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2008. ITC 2008. IEEE International
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-2402-3
  • Electronic_ISBN
    1089-3539
  • Type

    conf

  • DOI
    10.1109/TEST.2008.4700615
  • Filename
    4700615