Author :
Vollertsen, R.-P.
Author_Institution :
Infineon Technol. Corp., IBM Corp., Essex Junction, VT
fDate :
6/21/1905 12:00:00 AM
Abstract :
Burn-In is used to screen weak parts from a population of completely processed chips to assist in meeting reliability requirements. This tutorial provides a general introduction to burn-in. It is shown how burn-in improves the failure rate. Typical burn-in conditions, the burn-in models and an example of failure mechanisms are given. The impact of burn-in on technology reliability (hot carriers, gate oxide, electromigration) is discussed, emphasizing that the upper limits of the burn-in conditions can be controlled by technology reliability. Finally the benefits and disadvantages of burn-in are summarized
Keywords :
electromigration; hot carriers; semiconductor device reliability; burn-in; completely processed chips; electromigration; failure mechanisms; gate oxide; hot carriers; reliability requirements; Aging; Costs; Degradation; Large Hadron Collider; Packaging; Petroleum; Rivers; Shape; Testing; Wafer scale integration;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1999. IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-5649-7
DOI :
10.1109/IRWS.1999.830588
