DocumentCode
1736769
Title
Wafer Defects Detecting and Classifying System Based on Machine Vision
Author
Zhen, Zeng ; Shuguang, Dai ; Ping´an, Mu
Author_Institution
Univ. of Shanghai for Sci. & Technol., Shanghai
fYear
2007
Abstract
The wafer defects detecting and classifying system based on machine vision aims at inspecting macro wafer defects. After acquiring disk images using CCD, through digital images process we realized defects inspection and defects segmentation. Finally defects classification was achieved by neural networks. The experiment results prove that the proposed system features a strong background of specialty and can be applied into practice.
Keywords
CCD image sensors; computer vision; inspection; neural nets; CCD image sensor; defects classification; defects segmentation; digital images process; disk images; machine vision; neural networks; wafer defects classifying system; wafer defects detecting system; Digital images; Image segmentation; Inspection; Instruments; Machine vision; Mirrors; Neural networks; Optical distortion; Optical fiber networks; Optical reflection; defect detection; image process; machine vision; neural network; wafer;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Measurement and Instruments, 2007. ICEMI '07. 8th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-1136-8
Electronic_ISBN
978-1-4244-1136-8
Type
conf
DOI
10.1109/ICEMI.2007.4351196
Filename
4351196
Link To Document