Title :
Board-level solder joint reliability comparison of five unique memory package constructions
Author :
Newman, Keith ; Freda, Michael ; Ito, Hidenori ; Yama, Naoki ; Nakanishi, Eriko
Author_Institution :
Sun MicroSyst. Inc., Menlo Park, CA, USA
Abstract :
Sun Microsystems, Inc., investigated the board-level solder joint reliability of five unique package constructions of a 54/62 lead memory package. Following a process optimization study, the 0.8/1.0 mm grid chip scale package (CSP) devices were assembled on a complex test board by an advanced board assembly subcontractor, Suzuka Fuji Xerox. In addition to the numerous CSP devices, the test board also included a variety of flip-chip and wirebond BGA packages, and a ceramic column grid array package; only test results of the CSP devices are reported in this paper. Circuit board solder ball land pad (via-in-pad) diameters of 300 μm and 350 μm for the 54/62 lead CSP devices were evaluated. Testing also included a comparison between packages reflowed on to the circuit board using a conventional mass reflow furnace, and those using a production rework machine. The circuit board assemblies were temperature cycled between 0°C and 100°C, and electrically monitored for opens. Summary tables and figures comparing the reliability characteristics of the various chip-scale package constructions were generated
Keywords :
assembling; chip scale packaging; circuit reliability; integrated memory circuits; printed circuit manufacture; printed circuit testing; process monitoring; reflow soldering; thermal stresses; 0 to 100 C; 0.8 mm; 1 mm; 300 micron; 350 micron; CSP devices; board assembly subcontractor; board-level solder joint reliability; ceramic column grid array package; chip scale package; chip-scale package constructions; circuit board assemblies; circuit board solder ball land pad diameter; electrical monitoring; flip-chip BGA packages; mass reflow furnace; memory package; package construction; package reflow; production rework machine; reliability characteristics; temperature cycling; test board; via-in-pad diameter; wirebond BGA packages; Assembly; Ceramics; Chip scale packaging; Circuit testing; Lead; Packaging machines; Printed circuits; Soldering; Subcontracting; Sun;
Conference_Titel :
Electronic Materials and Packaging, 2000. (EMAP 2000). International Symposium on
Conference_Location :
Hong Kong
Print_ISBN :
0-7803-6654-9
DOI :
10.1109/EMAP.2000.904130
