• DocumentCode
    1745593
  • Title

    Ion energy distributions in plasma immersion ion implantation-theory and experiment

  • Author

    Kellerman, Peter L. ; Bernstein, James D. ; Bradley, Michael P.

  • Author_Institution
    Axcelis Technol., Beverly, MA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    484
  • Lastpage
    487
  • Abstract
    Much has been published recently stating the effectiveness of plasma immersion ion implantation (PIII) in producing ultra-shallow junctions (USJ). Although PIII is capable of producing USJ implants as effectively as conventional mass-analyzed ion implantation, there are several differences. One such difference, due to sheath dynamics and pulse characteristics, is that PIII implants always contain low energy components. Although such (shallower) components are not deleterious for USJ formation, there is much concern that they can be controlled repeatably. Others have developed sheath models which relate pulse current to ion energies, and have compared predicted currents to measurements of the total platen current. However, the total platen current includes contributions due to displacement currents (needed to create the high voltage negative pulse) as well as both plasma and secondary electron currents. We developed a Faraday cup embedded within the wafer platen which is capable of measuring the ion current alone. This ion current data, along with the platen voltage data has been be used to test and further refine the sheath model. The model was then used to predict the energy content of the ions, which was further tested by comparison with as-implanted SIMS profiles
  • Keywords
    ion implantation; plasma materials processing; plasma sheaths; semiconductor doping; semiconductor junctions; Faraday cup; PIII; as-implanted SIMS profiles; displacement currents; energy content; high voltage negative pulse; ion current; ion energies; ion energy distributions; low energy components; plasma immersion ion implantation; pulse characteristics; pulse current; sheath dynamics; sheath models; total platen current; ultra-shallow junctions; Current measurement; Implants; Plasma immersion ion implantation; Plasma measurements; Plasma sheaths; Predictive models; Pulse measurements; Semiconductor device modeling; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology, 2000. Conference on
  • Conference_Location
    Alpbach
  • Print_ISBN
    0-7803-6462-7
  • Type

    conf

  • DOI
    10.1109/.2000.924193
  • Filename
    924193