Abstract :
The presentation will start with an overview of functional and technology mapping of RF systems, ranging from RF amplifers to System-on-Chips (SoC´s), and from modules to Wafer-Level Chip-Scale Packaging (WLCSP). We´ll then discuss why (dedicated) Si-based component technologies are very price-performance competitive in volume markets, namely a combination of low-cost manufacturing in large volume Si fabs., as well as the right integration level. Three RF application segments will be illustrated, including cellular and microwaves, and it will be shown how the technologies are applied for optimal solutions.
