DocumentCode
175124
Title
Self-heat modeling of multi-finger n-MOSFETs for RF-CMOS applications
Author
Aoki, Hidetaka ; Kobayashi, Hideo
Author_Institution
Fac. of Sci. & Technol., Gunma Univ., Kiryu, Japan
fYear
2014
fDate
1-3 June 2014
Firstpage
119
Lastpage
122
Abstract
The purpose of this research is to characterize and model the self-heating effect of multi-finger n-channel MOSFETs. Self-heating effect (SHE) does not need to be analyzed for single-finger bulk CMOS devices. However, it should be considered for multi-finger n-channel MOSFETs that are mainly used for RF-CMOS applications. The SHE mechanism was analyzed based on a two-dimensional device simulator. A compact model, which is a BSIM6 model with additional equations, was developed and implemented in a SPICE simulator with Verilog-A language. Using the proposed model and extracted parameters excellent agreements have been obtained between measurements and simulations in DC and S-parameter domain whereas the original BSIM6 shows inconsistency between static DC and small signal AC simulations due to the lack of SHE. Unlike the generally-used sub-circuits based SHE models including in BSIMSOI models, the proposed SHE model can converge in large scale circuits.
Keywords
CMOS analogue integrated circuits; MOSFET; S-parameters; integrated circuit modelling; semiconductor device models; BSIM6 model; RF-CMOS application; S-parameter domain; SHE mechanism; SPICE simulator; Verilog-A language; compact model; generally-used subcircuit-based SHE model; multifinger n-channel MOSFET; self-heating effect model; single-finger bulk CMOS devices; small-signal AC simulation; static DC; two-dimensional device simulator; Current measurement; Logic gates; MOSFET; MOSFET circuits; Noise measurement; Semiconductor device modeling; Transmission line measurements; RF-CMOS; STI; modeling; multi-finger; self-heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Radio Frequency Integrated Circuits Symposium, 2014 IEEE
Conference_Location
Tampa, FL
ISSN
1529-2517
Print_ISBN
978-1-4799-3862-9
Type
conf
DOI
10.1109/RFIC.2014.6851674
Filename
6851674
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