• DocumentCode
    175160
  • Title

    235–275 GHz (x16) frequency multiplier chains with up to 0 dBm peak output power and low DC power consumption

  • Author

    Sarmah, Neelanjan ; Heinemann, B. ; Pfeiffer, Ullrich R.

  • Author_Institution
    IHCT, Univ. of Wuppertal, Wuppertal, Germany
  • fYear
    2014
  • fDate
    1-3 June 2014
  • Firstpage
    181
  • Lastpage
    184
  • Abstract
    Wideband x16 multiplier chains targeted for high speed communication and radar applications above 200 GHz are presented in this paper. The x16 topology is based on 4 cascaded Gilbert-cell-based frequency doublers without any hybrids and intermediate drive amplifiers. The low external input frequency (14-17.5 GHz), enables the use of very low-power frequency dividers and also interfacing with commercial synthesisers below 20 GHz. Two versions of the circuit were implemented. Version 1 is a standalone x16 chain and Version 2 is Version 1 plus wideband 3-stage PA. For Version 1, the measured peak output power is -8.5 dBm at 255 GHz with 40 GHz bandwidth (3 dB) and dc power consumption of 0.3 W. For Version 2, the peak output power is 0 dBm at 245 GHz with 30 GHz bandwidth (3 dB) and 0.7 W dc power consumption. These results are single ended on-wafer measurements without dembeding the 2.5 dB loss due to the output pad and balun. The available differential output power, to drive on-chip components like mixers, antennas etc, is -6 dBm for Version 1 and 2.5 dBm for Version 2. Additionally, break out sructures for wideband PAs operating at 240 GHz were characterised. The peak power gain at 240 GHz was 7 and 10 dB for the 3 and 4 stages respectively over a 30 GHz bandwidth. The measured Psat was 5 dBm at 240 GHz.
  • Keywords
    frequency multipliers; low-power electronics; millimetre wave frequency convertors; power consumption; balun; bandwidth 30 GHz; bandwidth 40 GHz; cascaded Gilbert-cell-based frequency doublers; differential output power; frequency 235 GHz to 275 GHz; high speed communication; loss 2.5 dB; low DC power consumption; mixers; on-chip components; output pad; power 0.3 W; power 0.7 W; radar applications; very low-power frequency dividers; wideband PAs; wideband x16 frequency multiplier chains; Impedance matching; Power demand; Power generation; Silicon germanium; Voltage-controlled oscillators; Wideband; 220–325 GHz; Frequency multipliers; HICUM; PA; SiGe HBT; Transmitter; millimeter wave integrated circuits; sub-millimeter wave integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits Symposium, 2014 IEEE
  • Conference_Location
    Tampa, FL
  • ISSN
    1529-2517
  • Print_ISBN
    978-1-4799-3862-9
  • Type

    conf

  • DOI
    10.1109/RFIC.2014.6851691
  • Filename
    6851691