DocumentCode :
1751852
Title :
Optimization of the thermodynamic characteristics of bolometric film structures
Author :
Medvedev, Yu.V. ; Nikolaenko, Yu M. ; Grishin, A.M. ; Khartsev, S.I.
Author_Institution :
Donetsk Physico-Technical Inst., Ukraine
Volume :
1
fYear :
2001
fDate :
2001
Firstpage :
383
Abstract :
The main advances in the film technology of HTSC and manganite containing materials during the last ten years are related to different electrical properties. A few efforts were directed at the investigation of thermodynamics characteristics. As a result the best modem film structures are not optimal for bolometric application. This is clearly seen from the low operating speed of non-cooled manganite bolometers. To improve the characteristics of HTSC bolometers, hybrid constructions in the base of the film structure were designed. However, even in the case of room and higher temperature bolometers this problem can be resolved directly with the help of optimization of the thermal kinetic coefficients of the film structure. The quantitative analysis of this possibility is the purpose of the author´s work
Keywords :
bolometers; high-temperature superconductors; microwave detectors; superconducting microwave devices; superconducting thin films; thermal resistance; thermodynamic properties; HTSC bolometers; HTSC film technology; LaAlO3; LaPbSrMnO3-LaAlO3; bolometric film structures; film/substrate interface; high temperature superconductors; hybrid constructions; microwave. power; thermal kinetic coefficients; thermodynamic characteristics optimisation; Bolometers; Electromagnetic heating; Frequency; Hafnium; Kinetic theory; Substrates; Temperature dependence; Temperature sensors; Thermal resistance; Thermodynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physics and Engineering of Millimeter and Sub-Millimeter Waves, 2001. The Fourth International Kharkov Symposium on
Conference_Location :
Kharkov
Print_ISBN :
0-7803-6473-2
Type :
conf
DOI :
10.1109/MSMW.2001.946861
Filename :
946861
Link To Document :
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