Efficient high-speed optoelectronic interconnects parameter extraction based on 3D field simulation

As the speed of integrated circuits increases, inductive coupling becomes an issue for the packaging interconnect technologies. This paper describes equivalent circuit extraction based on 3D full wave simulation for optoelectronic transmitter packaging interconnects. Simulation and extraction are performed for two kinds of transmitter modules: planar and multi-chip modules. The extracted equivalent circuit model of the optoelectronic interconnects is accurate and can be applied in packaging design state-of-the-art.