Title :
Compensation of high-speed drift by Cu-CMP APC in continuous input of high-mix products
Author :
Miyashita, N. ; Tamaki, K. ; Tsuchiyama, H. ; Uchida, N. ; Sakai, K. ; Yamamoto, K.
Author_Institution :
Hitachi Ltd., Yokohama, Japan
Abstract :
This paper presents a novel Cu-CMP APC that compensates the high-speed drift of thinning amount during the continuous input of high-mix products. Compensation is realized by estimating the polishing rate as the summation of the estimated standard drift and the amount of shift for each product group. A new algorithm in which the products with similar rates are systematically grouped has also been developed. Numerical simulations have demonstrated that application of the novel APC to SoC products reduced the 3σ of the thinning amount by 60.0%.
Keywords :
chemical mechanical polishing; system-on-chip; APC products; Cu-CMP APC; SoC products; compensation; continuous input; high-mix products; high-speed drift; numerical simulation; polishing rate; standard drift; Metrology; Production;
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2010 International Symposium on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4577-0392-8
Electronic_ISBN :
1523-553X