Prediction of slip generation during rapid thermal processing

Advanced device scaling requires thinner, higher quality oxides with low leakage and high reliability, and tighter process control, whereas a small temperature gradient on a heated wafer above 1000C causes a plastic deformation as crystalline slip, which strongly affects the device production yield. Hence, we propose a real-time technique to predict slip generation in rapid thermal processing (RTP) tools, and confirm the validity of the prediction model.