Pre bonding metrology solutions for 3D integration

Author

Riou, Gregory ; Gaudin, Gweltaz ; Landru, Didier ; Tempesta, Catherine ; Radu, Ionut ; Sadaka, Mariam ; Winstel, Kevin ; Kinser, Emily ; Hannon, Robert ; Kamenev, Boris V. ; Darwin, Michael ; Sachs, Robert

Author_Institution

SOITEC, Grenoble, France

fYear

2010

fDate

16-18 Nov. 2010

Firstpage

1

Lastpage

5

Abstract

This article reports the capability and the recent development of optical profilometry for monitoring 3D integrated circuits. In particular, the capability to profile transparent film stacks, which was quite challenging, is now accessible with the Unifire optical profilometer from Nanometrics. It is demonstrated that the obtained information in term of topography and edge roll off is paramount to improving the 3D integration process. In addition, the implementation of Nanometrics´ Advanced Film Capability (AFC) and/or Index Corrected Topography (ICT) may enable more detailed mapping of local within die film thickness and topography respectively.

Keywords

integrated circuit measurement; nanoelectronics; semiconductor thin films; three-dimensional integrated circuits; wafer bonding; wafer-scale integration; 3D integrated circuit; 3D integration; advanced film capability; circuit monitoring; die film thickness; index corrected topography; nanometrics; optical profilometry; prebonding metrology; transparent film stack; unifire optical profilometer; wafer direct bonding; Optical films; Optical imaging; Optical interferometry; Surface topography; Surface treatment; 3D integration; Metrology; Optical profilometry; Oxide Bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

3D Systems Integration Conference (3DIC), 2010 IEEE International

Conference_Location

Munich

Print_ISBN

978-1-4577-0526-7

Type

conf

DOI

10.1109/3DIC.2010.5751484

Filename

5751484