DocumentCode :
1755908
Title :
Aligning and Soldering Pure-Copper Nanowires for Nanodevice Fabrication
Author :
Wang, Bingdong ; Xu, Yan ; Yung, Kai-Leung ; Chen, Weijie ; Kang, Chun-lei
Author_Institution :
Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong
Volume :
22
Issue :
3
fYear :
2013
fDate :
41426
Firstpage :
519
Lastpage :
526
Abstract :
Pure-copper nanowires (NWs) were aligned and soldered without using  \\hbox {N}_{2} as protection gas in the alignment and soldering processes. Unlike other research works that used segmented NWs for easier wetting and connection, this paper demonstrates soldering pure-copper NWs on microelectrodes using triethanolamine as soldering agent in the high-temperature soldering environment. The results of the electrical conductivity measurement show that the contact resistance between the microelectrodes bridged by NWs was remarkably reduced by the nanosoldering. Moreover, the resistance between two electrodes changed from \\hbox {1.53}! \\times! \\hbox {10}^{5} to 136 \\Omega . The methods introduced in this paper are anticipated to be useful to nanodevice fabrication. \\hfill [2012-0164]
Keywords :
Copper; Force; Gold; Microelectrodes; Soldering; Tin; Microelectrodes; microelectromechanical devices; microsensors; soldering;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2012.2228844
Filename :
6378383
Link To Document :
بازگشت