DocumentCode
1756690
Title
Predictive Modeling of Channel Potential in 3-D NAND Flash Memory
Author
Yoon Kim ; Myounggon Kang
Author_Institution
Memory Div., Samsung Electron. Co. Ltd., Hwaseong, South Korea
Volume
61
Issue
11
fYear
2014
fDate
Nov. 2014
Firstpage
3901
Lastpage
3904
Abstract
For the first time, this brief analyzes the channel potential and capacitance in channel-stack type 3-D NAND flash memory structure. In addition, the effects of geometrical parameters on 3-D NAND flash design with gate-all-around and double-gate devices are studied. The model can be incorporated into a compact circuit model for 3-D NAND flash design optimization.
Keywords
NAND circuits; flash memories; integrated circuit design; integrated circuit modelling; three-dimensional integrated circuits; 3D NAND flash design optimization; capacitance; channel potential; channel-stack type 3D NAND flash memory structure; circuit model; double-gate devices; geometrical parameter effect; predictive modeling; Ash; Capacitance; Electric potential; IEEE Potentials; Logic gates; Predictive models; Solid modeling; 3-D NAND flash memory; capacitance modeling; nanowire SONOS; stacked array;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2014.2355918
Filename
6913535
Link To Document