• DocumentCode
    1756974
  • Title

    Parameter Extraction Procedure for a Physics-Based Power SiC Schottky Diode Model

  • Author

    Ruiyun Fu ; Grekov, Alexander E. ; Kang Peng ; Santi, Enrico

  • Author_Institution
    Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC, USA
  • Volume
    50
  • Issue
    5
  • fYear
    2014
  • fDate
    Sept.-Oct. 2014
  • Firstpage
    3558
  • Lastpage
    3568
  • Abstract
    A detailed parameter extraction procedure for a simple physics-based power silicon carbide (SiC) Schottky diode model is presented. The developed procedure includes the extraction of carrier concentration, active area, and thickness of the drift region, which are needed in the power Schottky diode model. The main advantage is that the developed procedure does not require any knowledge of device fabrication, which is usually not available to circuit designers. The only measurements required for the parameter extraction are simple static I-V characterization and C-V measurements. Furthermore, the physics-based SiC Schottky diode model whose parameters are extracted by the proposed procedure includes temperature dependences and is generally applicable to SiC Schottky diodes. The procedure is demonstrated for five Schottky diodes from two different manufacturers having the following ratings: 600 V/50 A, 1.2 kV/3 A, 1.2 kV/7 A, 1.2 kV/20 A, and 600 V/4 A.
  • Keywords
    Schottky diodes; carrier density; power semiconductor diodes; semiconductor device models; silicon compounds; wide band gap semiconductors; C-V measurements; SiC; active area; carrier concentration; drift region thickness; parameter extraction procedure; physics-based power SiC Schottky diode model; static I-V characterization; temperature dependences; Capacitance-voltage characteristics; Equations; Mathematical model; Parameter extraction; Schottky diodes; Silicon carbide; Temperature measurement; Parameter extraction procedure; Schottky diode; physics-based model; silicon carbide (SiC);
  • fLanguage
    English
  • Journal_Title
    Industry Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-9994
  • Type

    jour

  • DOI
    10.1109/TIA.2014.2304617
  • Filename
    6732948