An Equation-Based Circuit Model and Its Generation Tool for 3-D IC Power Delivery Networks With an Emphasis on Coupling Effect

Author

Chi-Hsuan Cheng ; Tai-Yu Cheng ; Cheng-Han Du ; Yi-Chang Lu ; Yih-Peng Chiou ; Liu, Siyuan ; Tzong-Lin Wu

Author_Institution

Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan

Volume

4

Issue

6

fYear

2014

fDate

41791

Firstpage

1062

Lastpage

1070

Abstract

In this paper, a methodology to characterize the electrical behaviors of power delivery networks (PDNs) in 3-D integrated circuits is presented. An automation tool is developed to effectively construct SPICE compatible equivalent circuit models of target PDNs. The core of the tool consists of three equation-based algorithms, which not only model the planar PDN and through-silicon vias in detail, but also the interactions between them through the silicon surface. Simulation results from the proposed SPICE model are in close agreement with the ones obtained from the full-wave simulator up to 40 GHz with more than 100 times speedup.

Keywords

equivalent circuits; integrated circuit modelling; power integrated circuits; three-dimensional integrated circuits; 3D IC power delivery networks; 3D integrated circuits; SPICE compatible equivalent circuit models; Si; automation tool; coupling effect; equation-based circuit model; silicon surface; through-silicon vias; Capacitance; Couplings; Integrated circuit modeling; Mathematical model; Silicon; Substrates; Wires; 3-D integrated circuits (3-D ICs); design automation and methodology; equation-based modeling; power delivery network (PDN); power delivery network (PDN).;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2316301

Filename

6807775