Title :
Blade Heat Dissipator With Room-Temperature Liquid Metal Running Inside a Sheet of Hollow Chamber
Author :
Manli Luo ; Yixin Zhou ; Jing Liu
Author_Institution :
Key Lab. of Cryogenics, Tech. Inst. of Phys. & Chem., Beijing, China
Abstract :
Through introducing the global flow driving mechanism, a highly compact liquid metal-based heat dissipator was proposed. The electromagnetic pump, conductive coolant as well as heat transportation channels were all integrated into a single sheet of hollow chamber, which leads to the blade like heat dissipator. The working performance of the cooling device was experimentally demonstrated through imposing various electric currents on the driving pump and subjecting to different heating power fluxes. It indicated that this blade heat dissiaptor can function effectively by eliminating the temperature difference between heat source and the whole region of the dissipator within a few seconds, which significantly resolves the difficulty of removing heat from the hotspot in quite limited space. Owing to its highly compact structure, fabrication simplicity, quick response, and wide range of working temperature, this cooling device is expected to be very useful in a wide variety of opto-electrical thermal management areas, such as notebook computers, mobile phones, or LEDs.
Keywords :
cooling; liquid metals; pumps; LEDs; blade heat dissipator; conductive coolant; cooling device; driving pump; electric currents; electromagnetic pump; global flow driving mechanism; heat source; heat transportation channels; highly compact liquid metal-based heat dissipator; hollow chamber; mobile phones; notebook computers; opto-electrical thermal management; power fluxes; room-temperature liquid metal; single sheet; temperature 293 K to 298 K; Blades; Cooling; Force; Heat pumps; Heat transfer; Resistance heating; Blade heat dissipator; cooling chamber; electromagnetic pumping; heat transfer enhancement; liquid metal; thermal management;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2013.2289736