DocumentCode :
1766189
Title :
Radiation Hardness Assurance Testing of Microelectronic Devices and Integrated Circuits: Test Guideline for Proton and Heavy Ion Single-Event Effects
Author :
Schwank, James R. ; Shaneyfelt, Marty R. ; Dodd, Paul E.
Author_Institution :
Sandia Nat. Labs., Albuquerque, NM, USA
Volume :
60
Issue :
3
fYear :
2013
fDate :
41426
Firstpage :
2101
Lastpage :
2118
Abstract :
This document gives detailed test guidelines for single-event upset (SEU), single-event latchup (SEL), single-event burnout (SEB), and single-event gate rupture (SEGR) hardness assurance testing. It includes guidelines for both heavy-ion and proton environments. The guidelines are based on many years of testing at remote site facilities and our present understanding of the mechanisms for single-event effects.
Keywords :
integrated circuit testing; proton effects; radiation hardening (electronics); heavy ion single-event effects; heavy-ion environments; integrated circuits; microelectronic devices; proton effects; proton environments; radiation hardness assurance testing; remote site facilities; single-event burnout; single-event gate rupture; single-event latchup; single-event upset; test guideline; Guidelines; Laser beams; Materials; Particle beams; Protons; Temperature measurement; Testing; Hardness assurance; heavy ions; protons; single-event effects; single-event gate burnout; single-event gate latchup; single-event gate rupture; single-event upset;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2013.2261317
Filename :
6530784
Link To Document :
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