• DocumentCode
    1767006
  • Title

    GaN-HEMT nonlinear modeling of single-ended and Doherty high-power amplifiers

  • Author

    Hajji, Rached ; Poulton, Matthew ; Crittenden, D.B. ; Gengler, Jeff ; Xia, Peter

  • Author_Institution
    TRIQUINT Semicond. Inc., Richardson, TX, USA
  • fYear
    2014
  • fDate
    6-9 Oct. 2014
  • Firstpage
    1317
  • Lastpage
    1320
  • Abstract
    A large-signal model for 120W high power packaged pre-matched transistor utilizing TriQuint´s TQGaN25HV HEMT technology is presented. It is composed of an array of unit-cell nonlinear EEHEMT models representing the high power GaN transistor die and EM based models for the input/output pre-matching circuits relaying the transistor die pads to the package leads. This model offers accurate small-signal and large-signal performance prediction at the package leads reference plane, as well as, when used in 50Ω matched evaluation boards of 120W single-ended and 240W Doherty PA´s. The model is validated in S-band against measured data, offering good prediction of Doherty PA key parameters, backoff efficiency and saturated peak power.
  • Keywords
    HEMT circuits; III-V semiconductors; gallium compounds; nonlinear network analysis; power HEMT; power amplifiers; wide band gap semiconductors; Doherty high power amplifier; GaN; HEMT nonlinear modeling; TriQuint´s TQGaN25HV HEMT technology; high power packaged prematched transistor; high power transistor die; large signal model; power 120 W; power 240 W; single ended amplifier; unit cell nonlinear EEHEMT models; Data models; Frequency measurement; Impedance; Integrated circuit modeling; Load modeling; Predictive models; Transistors; Doherty; GaN-on-SiC HEMT; Pre-matched Packaged Nonlinear Models; Single-ended;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2014 44th European
  • Conference_Location
    Rome
  • Type

    conf

  • DOI
    10.1109/EuMC.2014.6986686
  • Filename
    6986686