DocumentCode :
1767018
Title :
A 25W X-band GaN PA in SMT package
Author :
Leckey, J.G.
Author_Institution :
M/A-COM Technol. Solutions, Belfast, UK
fYear :
2014
fDate :
6-9 Oct. 2014
Firstpage :
1341
Lastpage :
1343
Abstract :
A single stage X-band (9-10GHz) PA module has been developed using a discrete 0.25um GaN transistor with 4.8mm gate periphery, that incorporates input and output matching via discrete substrates in package. The initial demonstrator module achieves 25W of power under pulsed conditions at 9.5-10GHz with Vds=50V, a peak efficiency of 41% and small signal gain of around 12dB. The PA was assembled in a 6mm overmolded QFN package. The power density and peak drain efficiency are in reasonable agreement with the process pcm performance at this frequency, given output matching losses have to be accounted for. This work demonstrates for the first time the feasibility of prematched GaN transistors and MMIC-like modules in high volume SMT packaging and to a frequency of 10GHz.
Keywords :
III-V semiconductors; gallium compounds; microwave power amplifiers; surface mount technology; wide band gap semiconductors; GaN; MMIC; QFN package; SMT package; X-band power amplifiers; demonstrator module; discrete substrates; frequency 9 GHz to 10 GHz; power 25 W; size 0.25 mum; size 4.8 mm; transistors; voltage 50 V; Gain; Gallium nitride; Impedance matching; Load modeling; MMICs; Microwave amplifiers; Solid modeling; GaN HEMT; MMIC; Power Amplifier;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference (EuMC), 2014 44th European
Conference_Location :
Rome
Type :
conf
DOI :
10.1109/EuMC.2014.6986692
Filename :
6986692
Link To Document :
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