• DocumentCode
    1775166
  • Title

    A hierarchical optimization framework for aggregating thermostatically controlled loads to minimize real-time thermal rating of overhead distribution lines

  • Author

    Haiming Wang ; Ke Meng ; FengJi Luo ; Zhao Yang Dong ; Zhao Xu ; Wong, Kit Po

  • Author_Institution
    Centre for Intell. Electr. Networks, Univ. of Newcastle, Newcastle, NSW, Australia
  • fYear
    2014
  • fDate
    23-26 Sept. 2014
  • Firstpage
    1769
  • Lastpage
    1773
  • Abstract
    A hierarchical optimization algorithm is presented in this study to optimize the aggregated thermostatically controlled loads (TCLs) to ensure the thermal rating of distribution lines is not violated. The key objective of the upper-level model is to minimize the thermal temperature of distribution lines and ensure it within the thermal rating. Meanwhile, the lower-level model is intended to strictly follow the dispatch instructions from the upper-level decision-maker by designing appropriate dispatch strategies for each aggregated TCLs in a specific time horizon. The developed models are solved by two different optimization software tools. Finally, a 10 kV overhead distribution line is studied to demonstrate the performance of the developed model and methodology.
  • Keywords
    load dispatching; load distribution; minimisation; power distribution lines; power overhead lines; TCL aggregation; dispatch instruction; hierarchical optimization algorithm; lower-level model; optimization software tool; overhead distribution line thermal rating; specific time horizon; thermal temperature minimization; thermostatically controlled load aggregation; upper-level model; voltage 10 kV; Abstracts; Buildings; Capacitance; Educational institutions; Home appliances; IEEE Potentials; Programming; Bi-level programming; demand response; hierarchical; thermal inertia; zonal dispatching architecture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electricity Distribution (CICED), 2014 China International Conference on
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/CICED.2014.6992259
  • Filename
    6992259