DocumentCode :
1780024
Title :
Space charge behaviours in polyethylene under combined AC and DC electric fields
Author :
Zhou, Changle ; Chen, Gang
Author_Institution :
Tony Davies High Voltage Lab., Univ. of Southampton, Southampton, UK
fYear :
2014
fDate :
19-22 Oct. 2014
Firstpage :
848
Lastpage :
851
Abstract :
Polyethylene has been one of the widely studied polymeric insulation materials. One of the major issues related to polymeric materials is the easy formation of space charge which may cause electric field enhancement. In this paper, a numerical simulation based on a bipolar charge injection/transport model is used to obtain characteristics of space charge in polyethylene under the combined AC and DC high voltage at room temperature. The bipolar charge injection/transport model, which is widely used in HVDC space charge simulation, is applied in this combined condition. The overall applied voltage, consisted of root mean square (RMS) values of 50 Hz AC voltage and DC voltage, is kept the same, while the DC component has been varied from 0 to 1. The simulated charge distributions present notable differences when DC offset is added compared with pure AC conditions. Besides, these differences become more significant when the offset ratio is increased. The total positive and negative charge amounts are calculated respectively by integrating the charge in the material, and a curve of net charge amount changing along with time is obtained.
Keywords :
carrier mobility; polymers; space charge; AC electric fields; AC high voltage; DC electric fields; DC high voltage; HVDC space charge simulation; bipolar charge injection-transport model; carrier mobility; charge distribution; electric field enhancement; numerical simulation; polyethylene; polymeric insulation material; root mean square values; space charge behaviour; temperature 293 K to 298 K; Electric fields; Insulation; Polyethylene; Space charge; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location :
Des Moines, IA
Type :
conf
DOI :
10.1109/CEIDP.2014.6995787
Filename :
6995787
Link To Document :
بازگشت