DocumentCode
1780025
Title
Detection of joule heating in polyimide films at high electric field and high temperature by infrared thermography
Author
Diaham, S. ; Belijar, G. ; Locatelli, M.-L. ; Lebey, T.
Author_Institution
LAPLACE (Lab. Plasma et Conversion d´Energie), Univ. de Toulouse; UPS, Narbonne, France
fYear
2014
fDate
19-22 Oct. 2014
Firstpage
606
Lastpage
609
Abstract
This paper reports an original way for dielectric characterizations under high electric field and high temperature based on the coupling between electric current measurements and real-time fast infrared (IR) thermography. Particularly, the Joule heating phenomena were quantified by 2D-temperature cartography in a polyimide (PI) film exposed to an initial temperature of 300 °C through IR observations of the electrode. In a first part, we describe the measurement setup and parameters used during the study. Then, the calibration methodology is presented from emissivity estimation to the verification of the sample temperature. Finally, 2D-temperature cartography is presented highlighting the surface (equivalent to bulk due to the low thickness of PI film) temperature increase when increasing the applied electric field. A Joule heating of 16 °C above the sample temperature is quantified in the investigated field range showing for the first time a clear experimental proof of the thermal origin of the breakdown mechanism in polymer materials under high field/high temperature.
Keywords
calibration; electric breakdown; infrared imaging; polymer films; temperature measurement; 2D-temperature cartography; Joule heating detection; breakdown mechanism; calibration; emissivity estimation; high electric field characterization; high temperature characterization; polyimide films; polymer materials; real-time fast infrared thermography; temperature 300 degC; Current measurement; Electric breakdown; Electric fields; Electrodes; Films; Heating; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2014 IEEE Conference on
Conference_Location
Des Moines, IA
Type
conf
DOI
10.1109/CEIDP.2014.6995788
Filename
6995788
Link To Document