• DocumentCode
    1782151
  • Title

    Measurement and analysis of wireless power distribution network using magnetic field resonance in 3D package and IC

  • Author

    Eunseok Song ; Jung, Daniel H. ; Youngwoo Kim ; Joungho Kim

  • Author_Institution
    Dept. of Electr. Eng., Terahertz Interconnection & Package Lab., Daejeon, South Korea
  • fYear
    2014
  • fDate
    12-16 May 2014
  • Firstpage
    370
  • Lastpage
    373
  • Abstract
    To overcome power distribution network (PDN) design challenges such as serious power noise, large system area burden, the wireless power transfer (WPT) system in the 3D package and IC is applied. In this study, the 3D multi-helix inductor is proposed for designing the 3D package and IC with a WPT scheme and an equivalent circuit modeling is also implemented. The fabricated package WPT system represents a voltage transfer ratio (VTR) of 77.4 % and a system-level power efficiency of 53.0 %. The wireless PDN impedance is analyzed to verify the performance of the 3D package and IC with a WPT scheme in terms of SSN. It shows excellent performance in terms of SSN because the DC voltage output section of the rectifier of the WPT system can be assumed as voltage regulator module (VRM). Also, it has a characteristic of a band-pass filter (BPF), which passes resonance frequencies only due to the magnetic field resonance characteristic of WPT. Thus, the 3D package and IC with a WPT scheme becomes an excellent PDN solution that can reduce such system area burden and power noise at the same time.
  • Keywords
    band-pass filters; equivalent circuits; inductive power transmission; integrated circuit design; integrated circuit modelling; integrated circuit packaging; magnetic resonance; radiofrequency power transmission; 3D multihelix inductor; 3D package; BPF; DC voltage output section; IC design; PDN design; SSN; VRM; VTR; band-pass filter; efficiency 53.0 percent; equivalent circuit modeling; magnetic field resonance; magnetic field resonance characteristic; package WPT system; power noise; rectifier; system-level power efficiency; voltage regulator module; voltage transfer ratio; wireless PDN impedance; wireless power distribution network analysis; wireless power distribution network measurement; wireless power transfer; Impedance; Inductors; Integrated circuits; Magnetic fields; Noise; Three-dimensional displays; Wireless communication; 3D package and IC; inductor design; magnetic field; power efficiency; resonance; simultaneous switching noise; wireless power distribution network; wireless power transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
  • Conference_Location
    Tokyo
  • Type

    conf

  • Filename
    6997172