• DocumentCode
    1782280
  • Title

    Improved surge protection of flip-chip gallium nitride-based HEMTs by metal-semiconductor-metal two-dimensional electron gas varactor

  • Author

    Liann-Be Chang ; Chien-Fu Shih ; Tung-Wuu Huang ; Chu-Yeh Tien ; Ping-Yu Kuei

  • Author_Institution
    Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
  • fYear
    2014
  • fDate
    12-16 May 2014
  • Firstpage
    717
  • Lastpage
    720
  • Abstract
    AlGaN/GaN high electron mobility transistor (HEMT) was designed with improved surge protection characteristic through the use of a MSM-2DEG varactor connected in series to the gate of HEMT. Under an ESD surge stress of 1100 V or below, the HEMT incorporating this protection feature doesn´t exhibit any change because the surge stress can be directly blocked by the MSM-2DEG varactor. Furthermore, flip-chip (FC) technology was also used to further improve the thermal performance and reliability of HEMTs. The heat generated in the two-dimensional electron gas (2DEG) channel of HEMT flows directly through the interconnect metal to the submount, and hence improve the thermal conduction. Based on these results, the proposed flip-chip HEMT with MSM-2DEG varactor can effectively improve the surge protection characteristics.
  • Keywords
    III-V semiconductors; aluminium compounds; electrostatic discharge; flip-chip devices; gallium compounds; heat conduction; high electron mobility transistors; metal-semiconductor-metal structures; semiconductor device reliability; surge protection; two-dimensional electron gas; varactors; wide band gap semiconductors; 2D electron gas channel; AlGaN-GaN; ESD surge stress; HEMT; MSM-2DEG varactor; flip-chip technology; high electron mobility transistor; metal-semiconductor-metal 2D electron gas varactor; surge protection; thermal conduction; Electrostatic discharges; Gallium nitride; HEMTs; Logic gates; MODFETs; Stress; Varactors; GaN; flip-chip; high electron mobility transistor (HEMT); surge protection; varactor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International Symposium on
  • Conference_Location
    Tokyo
  • Type

    conf

  • Filename
    6997238