Title :
Compact 10 ∼ 13 GHz GaN low noise amplifier MMIC using simple matching and bias circuits
Author :
Woojin Chang ; Young-Rak Park ; Jae-Kyoung Mun ; Sang-Choon Ko ; Gye-Ik Jeon
Author_Institution :
GaN Power Electron. Res. Sect., Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Abstract :
A compact 10 ~ 13 GHz low-noise amplifier (LNA) monolithic microwave integrated circuit (MMIC) using simple matching and bias circuits is designed and fabricated using AlGaN/GaN 0.25 μm high electron mobility transistor (HEMT) technology on silicon carbide (SiC) substrate. In order to reduce the chip size and simplify the structure of the LNA, the matching and bias circuits were combined functionally and structurally together and the meandered microstriplines were used. And the combined circuits also contributed to decrease the noise figure of the LNA. Therefore, the measured noise figures of the LNA are almost equal to the minimum noise figure of 2 × 100 μm device which was used for the first stage of the LNA. And also the chip size of the fabricated LNA is 1.7 × 0.8 mm2 including two ground-signal-ground (GSG) pads and the DC pads on the chip. The LNA shows a noise figure of 1.7 ~ 2.1 dB with a gain of 19 ~ 26 dB across the 10 ~ 13 GHz frequency range. In continuous wave (CW) conditions, it presents a saturated output power of 29 ~ 34 dBm for 10 ~ 13 GHz and also the output third-order intercept point (OIP3) of 42 dBm at 11.4 GHz.
Keywords :
III-V semiconductors; MMIC amplifiers; gallium compounds; high electron mobility transistors; integrated circuit design; integrated circuit noise; low noise amplifiers; microstrip lines; silicon compounds; wide band gap semiconductors; DC pads; GSG pads; GaN; HEMT technology; LNA; MMIC; OIP3; SiC; bias circuits; frequency 10 GHz to 13 GHz; gain 19 dB to 26 dB; ground-signal-ground pads; high electron mobility transistor technology; low noise amplifier; microstrip lines; monolithic microwave integrated circuit; noise figure; noise figure 1.7 dB to 2.1 dB; output third-order intercept point; silicon carbide substrate; size 0.25 mum; size 0.8 mm; size 1.7 mm; size 100 mum; Gallium nitride; HEMTs; MMICs; Microwave amplifiers; Microwave circuits; Noise figure; GaN; LNA; chip size reduction; matching circuit;
Conference_Titel :
European Microwave Integrated Circuit Conference (EuMIC), 2014 9th
Conference_Location :
Rome
DOI :
10.1109/EuMIC.2014.6997907