• DocumentCode
    1786907
  • Title

    Walking pads: Managing C4 placement for transient voltage noise minimization

  • Author

    Ke Wang ; Meyer, Brett H. ; Runjie Zhang ; Stan, Mircea ; Skadron, Kevin

  • Author_Institution
    Dept. of Comput. Sci., Univ. of Virginia, Charlottesville, VA, USA
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Transient voltage noise, including resistive and reactive noise, causes timing errors at runtime. We introduce a heuristic framework-Walking Pads-to minimize transient voltage violations by optimizing power supply pad placement. We show that the steady-state optimal design point differs from the transient optimum, and further noise reduction can be achieved with transient optimization. Our methodology significantly reduces voltage violations by balancing the average transient voltage noise of the four branches at each pad site. When we optimize pad placement using a representative stressmark, voltage violations are reduced 46-80% across 11 Parsec benchmarks with respect to the results from IR-drop-optimized pad placement. We also show that the allocation of on-chip decoupling capacitance significantly influences the optimal locations of pads.
  • Keywords
    integrated circuit layout; logic design; microprocessor chips; minimisation; C4 placement; IR-drop-optimized pad placement; Parsec benchmarks; noise reduction; on-chip decoupling capacitance; power supply pad placement optimization; reactive noise; resistive noise; steady-state optimal design point; transient optimization; transient voltage noise minimization; transient voltage violations; walking pads; Benchmark testing; Integrated circuit modeling; Noise; Optimization; Steady-state; System-on-chip; Transient analysis; Power distribution network; Power pad allocation; Voltage noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1145/2593069.2593243
  • Filename
    6881453