Title :
Copper-to-dielectric heterogeneous bonding for 3D integration
Author :
Wei Lin ; Juntao Li ; Washington, Joseph ; Rath, David ; Skordas, Spyridon ; Kirihata, Toshiaki ; Winstel, Kevin ; Peethala, Brown ; Demarest, J. ; Da Song ; Edelstein, D. ; Iyer, Srikrishna
Author_Institution :
Int. Bus. Machines, Albany Nanotech, Albany, NY, USA
Abstract :
A novel hybrid bonding process has been developed that achieved a successful copper/SiO2 heterogeneous bonding.
Keywords :
copper; dielectric materials; integrated circuit bonding; integrated circuit interconnections; metal-insulator boundaries; silicon compounds; three-dimensional integrated circuits; 3D integration; Cu-SiO2; copper-to-dielectric heterogeneous bonding; hybrid bonding process; Bonding; Business; Copper; Manganese; Reliability; Three-dimensional displays;
Conference_Titel :
Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on
Conference_Location :
Tokyo
Print_ISBN :
978-1-4799-5260-1
DOI :
10.1109/LTB-3D.2014.6886145