Title :
Usage of low-temperature co-fired ceramic in hermetic packaging
Author :
Klima, Milos ; Somer, Jakub ; Blahova, Lucie ; Prochazka, Michal ; Szendiuch, I.
Author_Institution :
Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
Abstract :
This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured - Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.
Keywords :
ceramic packaging; conductive adhesives; hermetic seals; vias; DuPont GreenTape 951PT; Heraeus HeraLock2000; air-tight package; air-tightness; bare-dies; conductive joints; hermetic package; low-temperature cofired ceramic; material thickness; oxygen transmission rate measurement; substrates; vias; Atmospheric measurements; Ceramics; Fabrication; Lamination; Springs; Substrates;
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
DOI :
10.1109/ISSE.2014.6887571