DocumentCode :
1794860
Title :
Working temperatures influence over the solder joints properties
Author :
Plotog, I. ; Vladescu, Marian
Author_Institution :
Center of Technol. Electron. & Interconnection Tech. - CETTI, Politeh. Univ. of Bucharest, Bucharest, Romania
fYear :
2014
fDate :
7-11 May 2014
Firstpage :
231
Lastpage :
236
Abstract :
It is an actual trend for electronic equipment to be used into growing range of working temperatures and at high level of the mechanical stress. As example, for the domains exempted by RoHS 2 EU Directive (it became law from January 2013) like aerospace, the standard maximum working temperature is 398.15K (125°C). The results of the comparative investigations regarding electrical and mechanical properties of the Lead/Lead-free solder joints function of working temperature and soldering thermal profile are presented in the paper. The experiments were designed based on previous work [1,2] having as starting point the “Homologous Temperature” concept [1,3,4], in order to respond to constrains imposed by the qualification processes of lead-free solder alloys for usage into exempted domains according to the RoHS 2 EU Directive [5,6].
Keywords :
RoHS compliance; internal stresses; soldering; RoHS 2 EU directive; homologous temperature concept; mechanical stress; solder joints; soldering thermal profile; temperature 398.15 K; Cooling; Electrical resistance measurement; Lead; Soldering; Temperature; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), Proceedings of the 2014 37th International Spring Seminar on
Conference_Location :
Dresden
Type :
conf
DOI :
10.1109/ISSE.2014.6887599
Filename :
6887599
Link To Document :
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