• DocumentCode
    1796352
  • Title

    Demonstration: Quilt packaging for heterogeneous integration of CNN systems

  • Author

    Bernstein, Gary H. ; Kulick, Johannes

  • Author_Institution
    Univ. of Notre Dame, Notre Dame, IN, USA
  • fYear
    2014
  • fDate
    29-31 July 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    A demonstration is presented at the 14th International Workshop on Cellular Nanoscale Networks and their Applications. The topic is the interchip interconnect technology known as Quilt Packaging™ (QP). QP offers many advantages for future, highly integrated CNN systems. The author will have demonstration materials on hand for inspection and discussion.
  • Keywords
    chip scale packaging; integrated circuit interconnections; nanoelectronics; CNN systems; QP; cellular nanoscale networks; chip-scale packaging; heterogeneous integration; interchip interconnect technology; quilt packaging; Educational institutions; Fabrication; Indexes; Shape; Chip-scale packaging; Integrated circuit packaging; Micromachining; Semiconductor device packaging; System-in-package;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Cellular Nanoscale Networks and their Applications (CNNA), 2014 14th International Workshop on
  • Conference_Location
    Notre Dame, IN
  • Type

    conf

  • DOI
    10.1109/CNNA.2014.6888610
  • Filename
    6888610
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1796352