Title :
System in package of bandgap voltage reference circuit with sub-1-V operation in CMOS for communication control and BioMedical applications
Author :
Wen Cheng Lai ; Jhin Fang Huang ; Tin Ye ; Wang Tyng Lay
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
Abstract :
A system in package low-voltage bandgap voltage reference (BGR) implemented in 90 nm CMOS process is designed, simulated, and measured. The bandgap reference circuit is optimized before fabrication in order to generate a temperature independent voltage reference. The load of output stage is a MOSFET active device controlled by the voltage reference so that the output accuracy increases. The overall circuit consists of a bandgap core circuit, an operational amplifier (op amp), and a bias circuit with start-up function. The simulated power supply rejection ratio (PSRR) and start-up circuit reaction time are 29 dB and approximately 2.5 us, respectively. Measured result of temperature coefficient (TC) achieves a 163 PPM/°C which is translated to the variation of the reference voltage is only 10 mV over the temperature ranges of 0 to 90 °C. With a 1.2 V supply voltage, the measured output voltage is 786 mV at room temperature and the power consumption is 2.1 mW. The chip area including dummy wiring, decoupling capacitor and pads is only 0.133 (0.449 × 0.297) mm2. The SIP CMOS can support communication control and biomedical networking.
Keywords :
CMOS integrated circuits; low-power electronics; reference circuits; system-in-package; BGR; MOSFET active device; PSRR; SIP CMOS process; TC; bandgap core circuit; biomedical networking; communication control; decoupling capacitor; dummy wiring; low-voltage bandgap voltage reference circuit; operational amplifier; pads; power 2.1 mW; simulated power supply rejection ratio; size 90 nm; start-up circuit reaction time; start-up function; system in package; temperature coefficient; temperature independent voltage reference; voltage 1.2 V; voltage 786 mV; Abstracts; CMOS integrated circuits; CMOS technology; Equations; Mathematical model; Performance evaluation; Temperature measurement; BioMedical applications; bandgap reference; bandgap voltage; temperature coefficient;
Conference_Titel :
Signal and Information Processing (ChinaSIP), 2014 IEEE China Summit & International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4799-5401-8
DOI :
10.1109/ChinaSIP.2014.6889323