DocumentCode
180274
Title
Infrared windows applied in switchgear assemblies: Taking another look
Author
Durocher, D.B. ; Loucks, D.
Author_Institution
Eaton Corp., Wilsonville, OR, USA
fYear
2014
fDate
5-9 Oct. 2014
Firstpage
1
Lastpage
6
Abstract
Maintenance of electrical power distribution assemblies applied in industry has been critical in assuring facility uptime and reliability. One important metric in assuring reliability is electrical terminations of energized conductors. During normal energized service, terminations both at conductor bus joints and at cable terminations are subject over time to thermal expansion and contraction, ultimately resulting in loosened connections and excessive heat. Deteriorating terminations left unchecked will ultimately fail, resulting in electrical hazards for personnel and also costly loss of production. Infrared (IR) inspection has proved to be an excellent maintenance method used to identifying problems with loose electrical terminations. However, the design of Internal Arc Classified (IAC) switchgear assemblies to address arc-flash concerns has changed assembly designs that now limiting line of sight access necessary for IR inspection via windows. This paper will discuss global Standards, how they affect switchgear designs and application of IR windows, then present some alternative technologies that in some applications may be more suitable.
Keywords
inspection; maintenance engineering; reliability; switchgear; thermal expansion; IR windows; assemblies; electrical power distribution assemblies; electrical terminations; energized conductors; facility uptime; infrared inspection; infrared windows; maintenance; reliability; switchgear assemblies; switchgear designs; thermal contraction; thermal expansion; Cameras; Conductors; Infrared detectors; Power distribution; Switchgear; Temperature sensors; Thermal analysis; Arc-Resistant Switchgear; IR Windows; Infrared Camera; Thermal Imaging; Thermal Sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Industry Applications Society Annual Meeting, 2014 IEEE
Conference_Location
Vancouver, BC
Type
conf
DOI
10.1109/IAS.2014.6978467
Filename
6978467
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