• DocumentCode
    180441
  • Title

    FD-SOI Technology Development and Key Devices Characteristics for Fast, Power Efficient, Low Voltage SoCs

  • Author

    Hartmann, Jean-Michel

  • Author_Institution
    STMicroelectron., Crolles, France
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Electronics is more and more pervasive in everyday life: smartphones, connected cars, Internet of Things... All this is not only about mobile energy efficient technologies: it is wireless and wireline connectivity, sensors. UTBB FD-SOI (Ultra Thin Body and Buried-oxide Fully Depleted Silicon On Insulator) is a planar semiconductor technology that introduced the advantages of fully depleted transistors from the 28nm technology node, which is cost optimal, allowing joining the advantages of a general purpose high speed technology with the ones of a low power one. The paper describes the development of the FD-SOI technology, the choice of devices centering, and their main characteristics, especially suited for high speed energy efficient operation, even in low voltage conditions, thanks to the their intrinsic characteristics offered by being fully depleted. Those, are not limited to digital logic devices, but extend to memory bit-cells (fast, low leakage, and operating at low voltage) and the exceptional analog characteristics of devices.
  • Keywords
    low-power electronics; silicon-on-insulator; system-on-chip; FD-SOI technology development; Si; UTBB FD-SOI; buried-oxide fully depleted silicon on insulator; fast SoC; fully depleted transistors; key devices characteristics; low voltage SoC; planar semiconductor technology; power efficient SoC; size 28 nm; ultra thin body; Digital signal processing; Energy efficiency; Low voltage; Mobile communication; Silicon; Transistors; VLIW;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium (CSICs), 2014 IEEE
  • Conference_Location
    La Jolla, CA
  • Type

    conf

  • DOI
    10.1109/CSICS.2014.6978554
  • Filename
    6978554