• DocumentCode
    180457
  • Title

    Investigation of Various Envelope Complexity Linearity under Modulated Stimulus Using a New Envelope Formulation Approach

  • Author

    Ogboi, F.L. ; Tasker, P.J. ; Akmal, M. ; Lees, J. ; Benedikt, J. ; Bensmida, S. ; Morris, Kirsten ; Beach, M. ; McGeehan, Joe

  • Author_Institution
    Centre for High Freq. Eng., Cardiff Univ., Cardiff, UK
  • fYear
    2014
  • fDate
    19-22 Oct. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In [1] a new formulation for quantifying the linearizing baseband voltage signal, injected at the output bias port, to linearize a device behaviour was introduced. A key feature of this approach is that since it is formulated in the envelope domain the number of linearization coefficient required is independent of the envelope shape, complexity. This property is validated by performing baseband linearization investigations on a 10W Cree GaN HEMT device. Modulated signals with increasing complexity 3, 5, and 9-tone modulated stimulus, at 1.5dB of compression, were utilized. In all cases just two-linearization coefficients needed to be determined in order to compute the output baseband signal envelope necessary. Intermodulation distortion was reduced to around -50dBc, a value very close to the dynamic range limit of the measurement system.
  • Keywords
    computational complexity; gallium compounds; high electron mobility transistors; intermodulation distortion; linearisation techniques; radiocommunication; semiconductor devices; Cree HEMT device; envelope complexity linearity investigation; envelope formulation approach; intermodulation distortion reduction; linearization coefficient; linearizing baseband voltage signal; modulated stimulus; wireless communications system; Baseband; Complexity theory; Current measurement; Frequency measurement; Power generation; Radio frequency; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium (CSICs), 2014 IEEE
  • Conference_Location
    La Jolla, CA
  • Type

    conf

  • DOI
    10.1109/CSICS.2014.6978563
  • Filename
    6978563