DocumentCode
1806181
Title
Fully depleted devices for designers: FDSOI and FinFETs
Author
Hook, Terence B.
Author_Institution
IBM Microelectron., Essex Junction, VT, USA
fYear
2012
fDate
9-12 Sept. 2012
Firstpage
1
Lastpage
7
Abstract
Technologies featuring fully depleted transistors are entering the mainstream for designs at the 28nm, 20nm, and 14nm nodes. Although these devices have been the playground of device engineers for more than a decade it is for the most part only recently that they have been introduced to circuit designers and logic chip integrators. The physical structure and many of the features - or lack thereof - of the transistors vis-à-vis conventional planar devices are different, opening some new doors and perhaps closing some old ones. In this paper we discuss both planar (variously called ETSOI/UTBB/FDSOI1) and three-dimensional (variously called FinFET or trigate or doublegate) fully depleted devices, comparing and contrasting them with one another and with classical devices, and in both bulk and SOI manifestations.
Keywords
MOSFET; silicon-on-insulator; FDSOI; FinFET; SOI manifestation; bulk manifestation; circuit designers; conventional planar devices; device engineers; fully-depleted transistors; logic chip integrators; planar fully-depleted devices; size 14 nm; size 20 nm; size 28 nm; three-dimensional fully-depleted devices; Doping; Epitaxial growth; FinFETs; Logic gates; Silicon; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference (CICC), 2012 IEEE
Conference_Location
San Jose, CA
ISSN
0886-5930
Print_ISBN
978-1-4673-1555-5
Electronic_ISBN
0886-5930
Type
conf
DOI
10.1109/CICC.2012.6330653
Filename
6330653
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