• DocumentCode
    1806181
  • Title

    Fully depleted devices for designers: FDSOI and FinFETs

  • Author

    Hook, Terence B.

  • Author_Institution
    IBM Microelectron., Essex Junction, VT, USA
  • fYear
    2012
  • fDate
    9-12 Sept. 2012
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Technologies featuring fully depleted transistors are entering the mainstream for designs at the 28nm, 20nm, and 14nm nodes. Although these devices have been the playground of device engineers for more than a decade it is for the most part only recently that they have been introduced to circuit designers and logic chip integrators. The physical structure and many of the features - or lack thereof - of the transistors vis-à-vis conventional planar devices are different, opening some new doors and perhaps closing some old ones. In this paper we discuss both planar (variously called ETSOI/UTBB/FDSOI1) and three-dimensional (variously called FinFET or trigate or doublegate) fully depleted devices, comparing and contrasting them with one another and with classical devices, and in both bulk and SOI manifestations.
  • Keywords
    MOSFET; silicon-on-insulator; FDSOI; FinFET; SOI manifestation; bulk manifestation; circuit designers; conventional planar devices; device engineers; fully-depleted transistors; logic chip integrators; planar fully-depleted devices; size 14 nm; size 20 nm; size 28 nm; three-dimensional fully-depleted devices; Doping; Epitaxial growth; FinFETs; Logic gates; Silicon; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2012 IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    0886-5930
  • Print_ISBN
    978-1-4673-1555-5
  • Electronic_ISBN
    0886-5930
  • Type

    conf

  • DOI
    10.1109/CICC.2012.6330653
  • Filename
    6330653