• DocumentCode
    1807281
  • Title

    Electro-thermo-mechanical analysis of a BiCMOS embedded RF-MEMS switch for temperatures from −55°C to + 125°C

  • Author

    Wietstruck, M. ; Kaynak, Mehmet ; Zhang, Wensheng ; Tillack, Bernd

  • Author_Institution
    IHP, Frankfurt (Oder), Germany
  • fYear
    2013
  • fDate
    21-23 Jan. 2013
  • Firstpage
    18
  • Lastpage
    20
  • Abstract
    The influence of temperature on electrical, mechanical and RF-performance of a BiCMOS embedded RF-MEMS switch has been demonstrated. Instead of exclusively estimating the temperature-dependent RF-MEMS switch key performance parameters, understanding the temperature influence on the mechanics together with the related electrical and RF-performance is preferred. A detailed thermo-mechanical analysis of the suspended membrane shows that the membrane shape and contact formation is strongly affected by temperature variations. It explains the significant influence of temperature on the pull-in voltage and on-state capacitance showing that a thermo-mechanical analysis is absolutely mandatory for an efficient process and design optimization to increase the temperature robustness.
  • Keywords
    BiCMOS integrated circuits; microswitches; parameter estimation; radiofrequency integrated circuits; thermal analysis; BiCMOS embedded RF-MEMS switch; RF-performance; contact formation; electrical performance; electrothermomechanical analysis; mechanical performance; membrane shape; on-state capacitance; temperature -55 degC to 125 degC; temperature variations; temperature-dependent RF-MEMS switch key performance parameter estimation; BiCMOS integrated circuits; Contacts; Robustness; Switches; Switching circuits; Temperature distribution; Temperature measurement; Monolithic integration; RF-MEMS switch; Temperature robustness; Thermo-mechanical analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Monolithic Integrated Circuits in RF Systems (SiRF), 2013 IEEE 13th Topical Meeting on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4673-1552-4
  • Electronic_ISBN
    978-1-4673-1551-7
  • Type

    conf

  • DOI
    10.1109/SiRF.2013.6489418
  • Filename
    6489418