DocumentCode :
1808095
Title :
Simulation Analysis on the Impact of Furnace Batch Size Increase in a Deposition Loop
Author :
Gan, Boon Ping ; Lendermann, Peter ; Quek, Kelvin Paht Te ; van der Heijden, B. ; Chin, Chen Chong ; Koh, Choon Yap
Author_Institution :
Planning & Oper. Manage. Group, Singapore Inst. of Manuf. Techno.
fYear :
2006
fDate :
3-6 Dec. 2006
Firstpage :
1821
Lastpage :
1828
Abstract :
In the dynamic environment of semiconductor manufacturing operations, a bottleneck could be created at the bake furnaces of the deposition loop as capacity expands. Upgrading of the bake furnaces by adding a lot-per-batch in the boat or purchasing a new furnace are two possible solutions to this problem. A simulation model was constructed to assist the decision making, with the behavior of the wet benches (upstream tools) and cluster tools (downstream tools) being modeled in detail. We concluded that a limited number of furnaces upgrade is sufficient to sustain the capacity expansion. But the bottleneck was shifted to an upstream tool, which required the backup tool to be activated to manage the queue. A loading policy that constrains batches to queue at maximum time before loading into the furnaces has to be implemented to balance the efficiency at the furnaces and their downstream tools, without compromising on the cycle time
Keywords :
coating techniques; discrete event simulation; furnaces; integrated circuit manufacture; integrated circuit metallisation; bake furnaces; cluster tools; deposition loop; furnace batch size; loading policy; semiconductor manufacturing operations; simulation analysis; wet benches; Analytical models; Discrete event simulation; Engineering management; Furnaces; Gallium nitride; Manufacturing processes; Semiconductor device manufacture; Technology management; Technology planning; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference, 2006. WSC 06. Proceedings of the Winter
Conference_Location :
Monterey, CA
Print_ISBN :
1-4244-0500-9
Electronic_ISBN :
1-4244-0501-7
Type :
conf
DOI :
10.1109/WSC.2006.322961
Filename :
4117819
Link To Document :
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